THERMAL-CONDUCTIVITY AND HEAT-CAPACITY STUDY OF A DENSIFIED A-SIO2

Authors
Citation
Dm. Zhu et Hf. Weng, THERMAL-CONDUCTIVITY AND HEAT-CAPACITY STUDY OF A DENSIFIED A-SIO2, Journal of non-crystalline solids, 185(3), 1995, pp. 262-267
Citations number
30
Categorie Soggetti
Material Science, Ceramics
ISSN journal
00223093
Volume
185
Issue
3
Year of publication
1995
Pages
262 - 267
Database
ISI
SICI code
0022-3093(1995)185:3<262:TAHSOA>2.0.ZU;2-L
Abstract
The thermal conductivity and the specific heat of a densified fused si lica a-SiO2 that has a density about 20% higher than that of undensifi ed one from 15 K to room temperatures were measured. The thermal condu ctivity shows a plateau at temperatures up to 60 K, and the magnitude of the plateau is higher than that of undensified a-SiO2. Above 60 K, the thermal conductivity increases approximately linearly with tempera ture. A simple analysis of the thermal conductivity data measured on t wo different portions of the sample reveals that the thermal conductiv ity plateau is most strongly affected by the densification. Specific h eat at temperatures below 60 K is slightly smaller than that of undens ified a-SiO2, and gradually approaches the value of undensified a-SiO2 at higher temperatures.