Rm. Bayazitov et al., FORMATION OF HEAVILY-DOPED SEMICONDUCTOR LAYERS BY PULSED ION-BEAM TREATMENT, Nuclear instruments & methods in physics research. Section B, Beam interactions with materials and atoms, 122(1), 1997, pp. 35-38
The formation of heavily doped Si and GaAs layers using implantation a
nd powerful pulsed ion beams has been investigated. The influence of t
he depth distribution of energy released by the ions on the temperatur
e profile and the electrically active impurity distribution in Si and
GaAs is analyzed. It is shown that as a consequence of the simultaneou
s action of impurity diffusion processes normal to the surface and dec
omposition of GaAs at the surface, the heavily doped (8 x 10(19) cm(-3
)) layers are formed in the subsurface region (0.1-0.5 mu m).