Kn. Otto et Cm. Ho, MODELING MANUFACTURING QUALITY CONSTRAINTS FOR PRODUCT DEVELOPMENT, Concurrent engineering, research and applications, 4(4), 1996, pp. 333-346
When bringing a new or improved product to market, a design and manufa
cturing enterprise can speed the process and improve the result by und
erstanding and designing within the manufacturing process used. We pro
pose process characterization modeling and experiments aimed at uncove
ring their effect upon product functional requirement metrics. In a re
al industrial design and manufacturing enterprise, however, social and
managerial problems drive any such design-for-manufacturing integrati
on modeling. Modeling and experiments are limited to activities that p
rovide direct answers to short-term real identified problems. This mea
ns that only a continuous improvement approach is practical to constru
ct process constraint models. We develop and demonstrate a methodology
to quantify the quality constraints imposed on a product design by it
s manufacturing process. We start with the sequence of operations tran
sforming the incoming material into the final product, which is diagra
mmed into a topology of the operational sequence. Next, performance me
trics are identified which correspond to the customer requirements. Us
ing engineering analysis, a basic model is developed relating known pr
oduct and material variables to the metric. Production data, either fr
om designed experiments or from natural variation occurring during pro
duction, are measured to validate the basic model. Next, each operatio
n in the process topology is analyzed for potential effect upon the mo
del. Modes of impact of each operation upon the metric are conceived,
and quantified into the basic model. These modes become either support
ed or not by the production data. The methodology, therefore, is one o
f continuously improving the understanding of the process imposed cons
traints to improve the product. We demonstrate the methodology with a
running example, characterizing the process imposed constraints upon a
low temperature cc-fired ceramic circuit assembly.