A new technique has solved the problem of Auger analysis of high-aspec
t ratio pits. The nondestructive analysis of these micron-size pits is
important for the development of gigabit memory chips. Very suitable
for the analysis is the coaxial scanning Auger microprobe (SAM), the e
lectron gun of which is coaxial with the cylindrical-mirror analyzer (
CMA). However, this SAM could not probe the bottom of a high-aspect ra
tio pit because the Auger signal is trapped in the pit. The solution t
o the problem was the use of an electrostatic deflector attached to th
e sample mount in front of the CMA. Theory and experiments proved the
advantage of this technique.