ECONOMICAL HIGH-DENSITY MULTILAYER INTERCONNECT SYSTEM DEVELOPED FOR MULTICHIP MODULES, LARGE MOTHERBOARDS

Authors
FLETCHER P
Citation
P. Fletcher, ECONOMICAL HIGH-DENSITY MULTILAYER INTERCONNECT SYSTEM DEVELOPED FOR MULTICHIP MODULES, LARGE MOTHERBOARDS, Electronic design, 43(12), 1995, pp. 42-46
Citations number
NO
Categorie Soggetti
Engineering, Eletrical & Electronic
Journal title
Electronic design → ACNP
ISSN journal
00134872
Volume
43
Issue
12
Year of publication
1995
Pages
42 - 46
Database
ISI
SICI code
0013-4872(1995)43:12<42:EHMISD>2.0.ZU;2-A