MECHANICAL BRUSH SCRUBBING FOR POST-CMP CLEAN

The current proliferation of chemical mechanical planarization (CMP) h as driven the need for a reliable method of removing particles from si licon wafers. Current mechanical brush scrubber systems are capable of reducing particle counts to acceptable levels. Mechanical, chemical, and electrical forces need to be controlled to optimize removal from v arious surfaces. Though post-CMP clean is the main current industry re quirement, other standard semiconductor processing steps can benefit f rom brush scrubbing as well.