J. Vandenberg et al., NONDESTRUCTIVE ANALYSIS OF MATERIALS AND DEVICES BY MEANS OF SCANNINGACOUSTIC MICROSCOPY, Analytica chimica acta, 297(1-2), 1994, pp. 73-86
The position of scanning acoustic microscopy (SCAM) in the context of
destructive versus non-destructive analytical techniques is discussed.
The principle of SCAM is touched briefly to a level which will allow
an understanding of the various examples of application presented in t
his article. Examples of SCAM applications will be reported (a) on dif
ferent types of non-destructive analysis such as: detection of delamin
ations, voids and microcracks, grain structures, geometrical multilaye
r composition, strain detection and surface roughness and (b) samples
from different fields of material science and technology: IC technolog
y, metals, plastics and advanced materials (glass fibre reinforced com
posites). The message of this contribution is to focus attention on SC
AM as a non-destructive, fast technique which can be used with success
in selected cases, where additional information about the sample is p
resent. However, theory of SCAM and hence interpretation of SCAM image
s is not straightforward and needs expert knowledge.