DAMAGES OF BONDED PARTS CAUSED BY THE THERMAL AND REACTIONARY CONTRACTION OF ADHESIVES DURING THE CURING PROCESS

Authors
Citation
A. Chudaska et O. Hahn, DAMAGES OF BONDED PARTS CAUSED BY THE THERMAL AND REACTIONARY CONTRACTION OF ADHESIVES DURING THE CURING PROCESS, Le Vide, les couches minces, (272), 1994, pp. 223-227
Citations number
2
Categorie Soggetti
Physics, Applied","Materials Science, Coatings & Films
Journal title
ISSN journal
02234335
Issue
272
Year of publication
1994
Supplement
S
Pages
223 - 227
Database
ISI
SICI code
0223-4335(1994):272<223:DOBPCB>2.0.ZU;2-E
Abstract
The employment of so-called one-component reaction adhesives, which jo in by the insertion of heat, has proved to be very advantageous. The c ontraction of reaction, which often appears during the cross-linking, and also the contraction of cooling of the cured bonding line has prov ed to be an especially difficult problem with the application of heat- setting adhesives. On account of these contraction processes there mig ht be damages of the bonded assemblies. Amoung other things this circu mstance depends on the temporal cross-linking process and the present temperatures as well as on the employed adhesive and constructive fact ors of influence. The cooling and curing concentrations occur at diffe rent times and with different temperatures and consequently have to be considered differently in relation to the mechanism of damage that re sult from them. With a developed method it is possible to analyse the timely course of the deformation of the part, caused by the contractio n depending on the influencing parameters.