GEOMETRY OF THE INTERFACIAL LAYER AND ITS ROLE FOR DESTRUCTION OF THEADHESION CONTACT POLYAMIDEIMIDE - COPPER FOIL

A new approach to the exposure of a role of the interfacial layer (IL) in the process of destruction of the polyamideimide (PAI) - copper fo il adhesion contacts has been developed. It consists in the simultaneo us measuring of the thickness h(i) of IL, the peeling efforts A of the copper foil from the PAI film, and strength sigma 6(r) and elongation epsilon(r) of the free PAI film during the curing process (100-250 de grees C). It is shown, that the values h(i) and A are changed extremel y and contrary (at T-crit = 190 degrees C h(i)(min) = 3 mu m and A(max ) = 1400 N/m). The several models of destruction of the adhesion conta cts on a cohesive mechanism within the bounds of IL have been analysed , It is exposured, that influence of the h(i) on the values A is media tely through the strength properties of the polymeric component.