TECHNOLOGY DEVELOPMENT OF A HIGH-DENSITY 32-CHANNEL 16-GB S OPTICAL-DATA LINK FOR OPTICAL INTERCONNECTION APPLICATIONS FOR THE OPTOELECTRONIC TECHNOLOGY CONSORTIUM (OETC)/

A parallel, 32-channel, high density (140 mu m pitch), 500 Mb/s NRZ, p oint-to-point, optical data link has been fabricated using existing Ga As IC, silicon optical bench (SiOB), and multichip module (MCM-D) tech nologies. The main components of the transmitter and the receiver modu les are a GaAs-based vertical cavity surface emitting laser (VCSEL) ar ray at 850 nm with its IC driver array chip and an integrated metal-se miconductor-metal (MSM) receiver (photodetector and signal processing circuits) array at 850 nm. The package module uses a modified 164 I/O JEDEC premolded plastic quad flat pack (PQFP) in combination with a po lymer film integrated circuit (POLYFIC) chip carrier. The electrical i nput and output are 500 Mb/s NRZ binary signals. The optical I/O in bo th modules consists of a directly-connectorized (nonpigtail) fiber arr ay block that plugs into the 32 x 1 optical fiber ribbon directly on o ne side and accepts 32 optical signals from the SEL array or delivers them to the MSM receiver array via a gold-coated 45 degrees polished f iber array mirror. The MACII-32 ribbon cable is an enhanced version of the standard MACII(TM) connector ribbon cable. This paper characteriz es key components of the optical data link, describes its package desi gn, and discusses preliminary component and optical data link test res ults.