HIGHLY SUPPRESSED BORON PENETRATION IN NO-NITRIDED SIO2 FOR P(-POLYSILICON GATED MOS DEVICE APPLICATIONS())

Citation
Lk. Han et al., HIGHLY SUPPRESSED BORON PENETRATION IN NO-NITRIDED SIO2 FOR P(-POLYSILICON GATED MOS DEVICE APPLICATIONS()), IEEE electron device letters, 16(7), 1995, pp. 319-321
Citations number
16
Categorie Soggetti
Engineering, Eletrical & Electronic
ISSN journal
07413106
Volume
16
Issue
7
Year of publication
1995
Pages
319 - 321
Database
ISI
SICI code
0741-3106(1995)16:7<319:HSBPIN>2.0.ZU;2-Y
Abstract
In this paper, we demonstrate the superior diffusion barrier propertie s of NO-nitrided SiO2 in suppressing boron penetration for p(+)-polysi licon gated MOS devices. Boron penetration effects have been studied i n terms of flatband voltage shift, decrease in inversion capacitance ( due to polysilicon depletion effect), impact on interface state densit y, and charge-to-breakdown, Results show that NO-nitrided SiO2, as com pared to conventional thermal SiO2, exhibit much higher resistance to boron penetration, and therefore, are very attractive for surface chan nel PMOS technology.