Lk. Han et al., HIGHLY SUPPRESSED BORON PENETRATION IN NO-NITRIDED SIO2 FOR P(-POLYSILICON GATED MOS DEVICE APPLICATIONS()), IEEE electron device letters, 16(7), 1995, pp. 319-321
In this paper, we demonstrate the superior diffusion barrier propertie
s of NO-nitrided SiO2 in suppressing boron penetration for p(+)-polysi
licon gated MOS devices. Boron penetration effects have been studied i
n terms of flatband voltage shift, decrease in inversion capacitance (
due to polysilicon depletion effect), impact on interface state densit
y, and charge-to-breakdown, Results show that NO-nitrided SiO2, as com
pared to conventional thermal SiO2, exhibit much higher resistance to
boron penetration, and therefore, are very attractive for surface chan
nel PMOS technology.