M. Vonarx et al., DETERMINATION OF THE HEAT-CAPACITY OF CMOS LAYERS FOR OPTIMAL CMOS SENSOR DESIGN, Sensors and actuators. A, Physical, 47(1-3), 1995, pp. 428-431
Static and dynamic electrical characterizations of heated microbridges
are used to determine the thermophysical thin-film properties of a co
mmercial CMOS IC process. The polysilicon layer and the passivation sa
ndwich exhibit thermal conductivities of 28+/-3.5 and 1.48+/-0.15 W/m
K; respectively. The SiO2 and passivation sandwiches have volumetric h
eat capacities of (1.05+/-0.1)X10(6) and (2.7+/-0.25)x10(6) J/m(3) K.