APPLICATIONS OF POROUS SILICON MICROSTRUCTURING

Authors
LANG W STEINER P SANDMAIER H
Citation
W. Lang et al., APPLICATIONS OF POROUS SILICON MICROSTRUCTURING, Journal of micromechanics and microengineering, 5(2), 1995, pp. 175-176
Citations number
4
Categorie Soggetti
Engineering, Eletrical & Electronic","Engineering, Mechanical
Journal title
Journal of micromechanics and microengineering → ACNP
ISSN journal
09601317
Volume
5
Issue
2
Year of publication
1995
Pages
175 - 176
Database
ISI
SICI code
0960-1317(1995)5:2<175:AOPSM>2.0.ZU;2-M
Abstract
We present a new technology that uses the selective generation and etc hing of porous silicon. This technology combines the advantages of sur face micromachining (small area consumption, CMOS compatibility, front side lithography) with the advantage of bulk micromachining (large di stance, no sticking). The practical application is shown in two exampl es: a free-standing polysilicon bridge for flow measurement and a thin -film sensor for a thermal transducer.