Ra. Levy et al., PLASMA-ENHANCED CHEMICAL-VAPOR-DEPOSITION OF SI-N-C-H FILMS FROM ENVIRONMENTALLY BENIGN ORGANOSILANES, Materials letters, 24(1-3), 1995, pp. 47-52
The environmentally benign precursors diethylsilane (DES) and di-t-but
ylsilane were used with NH3 to synthesize hydrogenated silicon carboni
tride films by plasma enhanced chemical vapor deposition. The growth k
inetics and film properties were examined as a function of deposition
temperature, pressure, and NH3/organosilane ratio. The growth rate was
observed to decrease with higher temperature and higher NH3/organosil
ane ratio while increasing with higher total pressure. Values of index
of refraction, stress, hardness, and Young's modulus were measured as
a function of processing variables and related to film density and re
sulting film compositions. Oxidation of the films was noted to occur a
t low deposition temperatures, low NH3/organosilane ratios, and high p
ressures. Carbon was present in all deposits and decreased slightly wi
th higher NH3/organosilane flow ratios.