High-performance integrated circuits (IC) require innovations in elect
ronic packaging designs and materials to accommodate greater signal in
put/output (I/O) density and higher operating powers. Adhesion between
package materials is paramount in maintaining the integrity and perfo
rmance of the package under a variety of environmental conditions. Thi
s article presents an overview of factors affecting adhesion and inter
facial integrity. Specific examples address some interfaces found in a
tape ball grid array (TBGA) packaging structure, illustrating the use
of several analytical methods and adhesion measurement techniques.