ADHESION ISSUES IN ELECTRONIC PACKING

High-performance integrated circuits (IC) require innovations in elect ronic packaging designs and materials to accommodate greater signal in put/output (I/O) density and higher operating powers. Adhesion between package materials is paramount in maintaining the integrity and perfo rmance of the package under a variety of environmental conditions. Thi s article presents an overview of factors affecting adhesion and inter facial integrity. Specific examples address some interfaces found in a tape ball grid array (TBGA) packaging structure, illustrating the use of several analytical methods and adhesion measurement techniques.