AN APPLICATION OF CONFOCAL SCANNING BEAM LASER MICROSCOPY (CSBLM) TO THE ELECTRODEPOSITION OF COPPER

Authors
LING X GU ZH FAHIDY TZ
Citation
X. Ling et al., AN APPLICATION OF CONFOCAL SCANNING BEAM LASER MICROSCOPY (CSBLM) TO THE ELECTRODEPOSITION OF COPPER, Electrochimica acta, 40(11), 1995, pp. 1789-1793
Citations number
20
Categorie Soggetti
Electrochemistry
Journal title
Electrochimica acta → ACNP
ISSN journal
00134686
Volume
40
Issue
11
Year of publication
1995
Pages
1789 - 1793
Database
ISI
SICI code
0013-4686(1995)40:11<1789:AAOCSB>2.0.ZU;2-T
Abstract
Structural characteristics of copper electrodeposition in a laboratory -scale copper electrorefining cell, studied by confocal scanning beam laser microscopy (CSBLM), are presented. Quantitative description of t he roughness of the surface is provided by three-dimensional reconstru cted images, and sectional depth profiles of the surface via digital i mage processing are shown along with surface roughness distribution. Q uantitative information about the effect of current density on surface roughness is of direct interest to industrial copper electrorefining.