Dm. Dobkin et al., MECHANISMS OF DEPOSITION OF SIO2 FROM TEOS AND RELATED ORGANOSILICON COMPOUNDS AND OZONE, Journal of the Electrochemical Society, 142(7), 1995, pp. 2332-2340
We have studied the deposition of silicon dioxide by thermal chemical
vapor deposition from tetraethylorthosilicate (TEOS) and ozone, using
a unique linear gas injection configuration and operating pressures of
10 Tone to atmosphere (approximate to 760 Torr). We have compared the
experimental results with simulations incorporating finite-difference
estimation of fluid flow fields, temperature distribution, thermally
initiated decomposition of ozone, and reaction of TEOS and ozone at th
e surface and in the gas phase. We have demonstrated that a parasitic
gas-phase reaction, which consumes TEOS without contributing to deposi
tion on the substrate, is necessary to explain correctly results obtai
ned at high pressures, and that at pressures of less than 200 Torr, th
is reaction simply contributes to the total deposited film. We propose
a general scheme for surface reactions, which accounts for the discre
pancies between the simple gas-phase reaction model and the observed o
ther temperature dependence, and allows us to incorporate aspects of t
he behavior of other organosilane precursors; we suggest explanations
for observed variations in film properties with deposition rate, condi
tions, and substrate surfaces.