Tungsten hexafluoride adsorbs on tungsten surfaces and reacts to form
WF5, which desorbs at about 250 K. At higher temperatures, WF6 desorbs
. Tungsten fluoride desorption was not affected by co-adsorption of H-
2 or H2O2 so production of WF5 appears to be an unavoidable feature of
tungsten chemical vapor deposition processes based on WF6. The initia
l sticking coefficient for WF6 on tungsten at 240 K is about 10(-3).