METAL-ORGANIC CHEMICAL-VAPOR-DEPOSITION OF COPPER USING HYDRATED COPPER FORMATE AS A NEW PRECURSOR

Citation
Mj. Mouche et al., METAL-ORGANIC CHEMICAL-VAPOR-DEPOSITION OF COPPER USING HYDRATED COPPER FORMATE AS A NEW PRECURSOR, Thin solid films, 262(1-2), 1995, pp. 1-6
Citations number
30
Categorie Soggetti
Physics, Applied","Material Science","Physics, Condensed Matter
Journal title
ISSN journal
00406090
Volume
262
Issue
1-2
Year of publication
1995
Pages
1 - 6
Database
ISI
SICI code
0040-6090(1995)262:1-2<1:MCOCUH>2.0.ZU;2-X
Abstract
Copper films were obtained by metal-organic chemical vapour deposition using hydrated copper formate. The films were deposited on Si(100) an d sputtered TiN/Si(100) 4-in wafers, at substrate temperatures of abou t 300 degrees C, with a reducing or inert carrier gas. Results from X- ray diffraction and X-ray photoelectron spectroscopy indicated a pure, crystalline and oxygen-free copper. Different film morphologies were observed by scanning electron microscopy: both continuous films and in homogeneous films with copper crystallites monodirectionally oriented were observed. In situ mass-spectroscopy analysis allows the proposal of some reaction mechanisms and highlights the importance of the initi al hydration level of the precursor on the nucleation rate.