COPPER POLYIMIDE INTERACTION - A LOCAL SPIN-DENSITY STUDY/

Citation
A. Ouhlal et al., COPPER POLYIMIDE INTERACTION - A LOCAL SPIN-DENSITY STUDY/, Journal of adhesion science and technology, 9(7), 1995, pp. 971-982
Citations number
32
Categorie Soggetti
Engineering, Chemical","Material Science",Mechanics
ISSN journal
01694243
Volume
9
Issue
7
Year of publication
1995
Pages
971 - 982
Database
ISI
SICI code
0169-4243(1995)9:7<971:CPI-AL>2.0.ZU;2-9
Abstract
The interactions between a copper atom and various model molecules, ph thalimide (PIM), PMDA and amino phenol (PAP), which represent well the functionalities of the polyimide PMDA-ODA, are studied using the quan tum chemical local density functional (LDF) method. We found that Cu i nteracts preferentially with the PMDA's model molecules and less with the PAP. For the Cu/PIM and Cu/PMDA systems, four interaction sites ha ve been investigated: the nitrogen atom, the phenyl ring, the five-mem bered imide ring, and the carbonyl group. The last site (C=O) was foun d to be the favored interaction site for Cu. The corresponding bond di ssociation energy is 1.20 eV in both Cu/PMDA and Cu/PIM. In the case o f Cu/PAP, the nitrogen and C-O bond sites have been investigated. The corresponding total energies differ only by 0.05 eV. The binding energ y for Cu/PAP is 0.65 eV. Thus, the PMDA carbonyl group is the favored site for bonding with a Cu atom. As shown in our previous study on Cr/ PMDA, Cr is more reactive than Cu and also interacts with the C=O grou p. Our results are in agreement with X-ray Photoelectron Spectroscopy (XPS) and Infra-Red Reflection Absorption Spectroscopy (IRRAS) measure ments carried out on Cu/polyimide interfaces.