Silicon oxide (SiOx) and erbium oxide (ErOx) layers in the form of SiO
x/ErOx/SiOx/Si structures were sequentially deposited onto silicon sub
strates by reactive RF-sputtering without breaking the vacuum. The str
uctures were subsequently heat treated at 800 degrees C under an argon
pressure of 10(-3) mbar. XPS measurements revealed that the layers th
us obtained are homogeneous. The relative intensities of the Si2p, Er4
d and O 1s core level peaks suggest a Er:Si:O composition ratio equal
to 2:2:7, Furthermore, the chemical shifts observed for the Si2p and E
r4d peaks showed the formation of a compound in which silicon (Si) and
erbium (Er) are, respectively, in tetrahedral and octahedral oxygen e
nvironments. XRD measurements showed the formation of erbium pyrosilic
ate (Er2Si2O7) which is consistent with the XPS results.