LEAKAGE CURRENT REDUCTION DUE TO HOT-CARRIER EFFECTS IN N-CHANNEL POLYCRYSTALLINE SILICON THIN-FILM TRANSISTORS

Citation
G. Tallarida et al., LEAKAGE CURRENT REDUCTION DUE TO HOT-CARRIER EFFECTS IN N-CHANNEL POLYCRYSTALLINE SILICON THIN-FILM TRANSISTORS, Journal of non-crystalline solids, 187, 1995, pp. 195-198
Citations number
11
Categorie Soggetti
Material Science, Ceramics
ISSN journal
00223093
Volume
187
Year of publication
1995
Pages
195 - 198
Database
ISI
SICI code
0022-3093(1995)187:<195:LCRDTH>2.0.ZU;2-T
Abstract
As is well known, the application of gate-voltage stresses in conjunct ion with high source-drain voltages, V-ds, modifies the electrical cha racteristics of polycrystalline silicon thin film transistors. In part icular negative gate-voltage stresses on n-channel devices usually red uce both the leakage current and the transconductance. In this paper a complete analysis of hot carrier effects induced by different gate-bi as stresses at high V-ds is presented and discussed in terms of trap a nd interface state creation. It is shown that in certain stress regime s the leakage current can be reduced without the accompanying transcon ductance degradation.