THE ORIGIN OF DEFECTS IN SIO2 THERMALLY GROWN ON CZOCHRALSKI SILICON SUBSTRATES
Citation
M. Itsumi et al., THE ORIGIN OF DEFECTS IN SIO2 THERMALLY GROWN ON CZOCHRALSKI SILICON SUBSTRATES, Journal of applied physics, 78(3), 1995, pp. 1940-1943
Categorie Soggetti
Physics, Applied
SICI code
0021-8979(1995)78:3<1940:TOODIS>2.0.ZU;2-K
Abstract
We have observed the origin of defects in SiO2 thermally grown on Czoc
hralski silicon substrates. Samples were prepared by copper decoration
to locate oxide defects, focused ion beam etching to mark them, and s
ubsequent silicon-substrate thinning for transmission electron microsc
ope observation. Polyhedron structures with sizes ranging from 150 to
300 nm are found in the underlying silicon-substrate surface layer jus
t under the oxide defects. Two polyhedron structures superimposed on e
ach other are also observed. It is believed that these structures are
related to the presence of oxygen precipitates. Oxide defects are thou
ght to arise due to oxide thinning induced at the edge of the silicon-
substrate surface adjacent to the octahedron structures. (C) 1995 Amer
ican Institute of Physics.