A fabrication method and emission characteristics of polycrystalline s
ilicon (poly-Si) gated field emitters have been presented, The fabrica
tion combines mold emitter fabrication and anodic bonding techniques t
o transfer the emitters to a Pyrex glass substrate, The tantalum gated
structures were fabricated by an etch-back technique using a photores
ist process, and a gate opening of about 0.7 mu m has been successfull
y obtained. The emission characteristics of the fabricated poly-Si fie
ld emitters were also presented, showing high current drivability.