The stressed-induced leakage current (SILC) in ultrathin SiO2 with thi
cknesses ranging from 40 to 70 Angstrom is studied. Results indicate t
hat the trap creation mechanism responsible for SILC is hydrogen-relat
ed. Reduced SILC can be achieved in scaled SiO2 if the stress electric
field is kept below a threshold value that increases with decreasing
oxide thickness. Annealing of SiO2 in pure NO ambient is also shown ro
be an extremely effective approach to realising SILC reduction in ult
rathin SiO2.