STUDY OF STRESS-INDUCED LEAKAGE CURRENT IN SCALED SIO2

Citation
Lk. Han et al., STUDY OF STRESS-INDUCED LEAKAGE CURRENT IN SCALED SIO2, Electronics Letters, 31(14), 1995, pp. 1202-1204
Citations number
14
Categorie Soggetti
Engineering, Eletrical & Electronic
Journal title
ISSN journal
00135194
Volume
31
Issue
14
Year of publication
1995
Pages
1202 - 1204
Database
ISI
SICI code
0013-5194(1995)31:14<1202:SOSLCI>2.0.ZU;2-0
Abstract
The stressed-induced leakage current (SILC) in ultrathin SiO2 with thi cknesses ranging from 40 to 70 Angstrom is studied. Results indicate t hat the trap creation mechanism responsible for SILC is hydrogen-relat ed. Reduced SILC can be achieved in scaled SiO2 if the stress electric field is kept below a threshold value that increases with decreasing oxide thickness. Annealing of SiO2 in pure NO ambient is also shown ro be an extremely effective approach to realising SILC reduction in ult rathin SiO2.