T. Furuhara et al., ATOMIC-STRUCTURE OF INTERPHASE BOUNDARY ENCLOSING BCC PRECIPITATE FORMED IN FCC MATRIX IN A NI-CR ALLOY, Metallurgical and materials transactions. A, Physical metallurgy andmaterials science, 26(8), 1995, pp. 1971-1978
The atomic structure of the interphase boundaries enclosing body-cente
red cubic (bcc) lath-shape precipitates formed in the face-centered cu
bic (fcc) matrix of a Ni-45 mass pct Cr alloy was examined by means of
conventional and high-resolution transmission electron microscopy (HR
TEM). Growth ledges were observed on the broad faces of the laths. The
growth ledge terrace (with the macroscopic habit plane similar to(112
)(fcc)/(23(1) over bar)(bcc)) contains a regular array of structural l
edges whose terrace is formed by the (111)(fcc)/(110)(bcc) planes. A s
tructural ledge has an effective Burgers vector corresponding to an a/
12[1(2) over bar1$](fcc) transformation dislocation in the fcc --> bcc
transformation. The side facet (and presumably the growth ledge riser
) of the bcc lath contains two distinct types of lattice dislocation a
ccommodating transformation strains. One type is glissile dislocations
, which exist on every six layers of parallel close-packed planes. The
se perfectly accommodate the shear strain caused by the stacking seque
nce change from fee to bcc. The second set is sessile misfit dislocati
ons (similar to 10 nm apart) whose Burgers vector is a/3[111](fcc) = a
/2[110](bcc). These perfectly accommodate the dilatational strain alon
g the direction normal to the parallel close-packed planes. These resu
lts demonstrate that the interphase boundaries enclosing the laths are
all semicoherent. Nucleation and migration of growth ledges, which ar
e controlled by diffusion of substitutional solute atoms, result in th
e virtual displacement of transformation dislocations accompanying the
climb of sessile misfit dislocations and the glide of glissile disloc
ations simultaneously. Such a growth mode assures the retention of ato
mic site correspondence across the growing interface.