Polycrystalline thin films are widely used in the electronics industry
and in surface protection applications. For most cases, a single crys
tal film would be preferable but is too costly or simply impossible to
achieve. Thus, the grain boundaries are regarded as a necessary evil.
We discuss the behavior of grain boundaries during film formation, pr
ocessing and utilization, illustrating beneficial as well as deleterio
us effects. Some potential strategies for the control of grain boundar
y behavior are derived by the application of basic interfacial science
.