THE USE AND CONTROL OF GRAIN-BOUNDARIES IN THIN-FILMS

Authors
Citation
Ah. King et Ke. Harris, THE USE AND CONTROL OF GRAIN-BOUNDARIES IN THIN-FILMS, Canadian metallurgical quarterly, 34(3), 1995, pp. 155-163
Citations number
27
Categorie Soggetti
Metallurgy & Metallurigical Engineering
ISSN journal
00084433
Volume
34
Issue
3
Year of publication
1995
Pages
155 - 163
Database
ISI
SICI code
0008-4433(1995)34:3<155:TUACOG>2.0.ZU;2-K
Abstract
Polycrystalline thin films are widely used in the electronics industry and in surface protection applications. For most cases, a single crys tal film would be preferable but is too costly or simply impossible to achieve. Thus, the grain boundaries are regarded as a necessary evil. We discuss the behavior of grain boundaries during film formation, pr ocessing and utilization, illustrating beneficial as well as deleterio us effects. Some potential strategies for the control of grain boundar y behavior are derived by the application of basic interfacial science .