Hd. Solomon et Ed. Tolksdorf, ENERGY APPROACH TO THE FATIGUE OF 60 40 SOLDER .1. INFLUENCE OF TEMPERATURE AND CYCLE FREQUENCY/, Journal of electronic packaging, 117(2), 1995, pp. 130-135
This study correlates previously published fatigue life data with the
hysteresis energy, and compares this to the previous correlation's wit
h the applied plastic strain. It was found that, while the hysteresis
energy could be used to describe the fatigue life, corrections must be
made to account for the temperature and strain rate dependence of the
flow stress. Because of these factors, it is believed that the plasti
c strain, and plot the hysteresis energy, is the true governing factor
in determining the fatigue life. Part I (described here) covers only
the influence of temperature and cycle frequency for symmetric cycling
. Part II, to be published, will deal with hold time and asymmetric cy
cling.