WAFER-SCALE INTEGRATION - FOREWORD

Authors
CHAPMAN GH BREWER JE TEWKSBURY SK
Citation
Gh. Chapman et al., WAFER-SCALE INTEGRATION - FOREWORD, IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 18(3), 1995, pp. 404-405
Citations number
NO
Categorie Soggetti
Engineering, Eletrical & Electronic","Engineering, Manufacturing","Material Science
Journal title
IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging → ACNP
ISSN journal
10709894
Volume
18
Issue
3
Year of publication
1995
Pages
404 - 405
Database
ISI
SICI code
1070-9894(1995)18:3<404:WI-F>2.0.ZU;2-9