Mba. Hussaini et al., DEFECT AND FAULT-TOLERANT INTERCONNECTION STRATEGIES FOR WASP DEVICES, IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 18(3), 1995, pp. 416-423
While WSI-based devices continue to be of particular interest for appl
ications with severe performance, size, weight, power, cost, and relia
bility requirements [1]-[3], various implementation constraints in the
past, including interconnect defect occurrences, have prevented their
successful realization, This paper presents an investigation into def
ect and fault tolerant interconnect strategies for a representative WS
I device, WASP (WSI Associative String Processor [3]).