DEFECT AND FAULT-TOLERANT INTERCONNECTION STRATEGIES FOR WASP DEVICES

Citation
Mba. Hussaini et al., DEFECT AND FAULT-TOLERANT INTERCONNECTION STRATEGIES FOR WASP DEVICES, IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 18(3), 1995, pp. 416-423
Citations number
23
Categorie Soggetti
Engineering, Eletrical & Electronic","Engineering, Manufacturing","Material Science
ISSN journal
10709894
Volume
18
Issue
3
Year of publication
1995
Pages
416 - 423
Database
ISI
SICI code
1070-9894(1995)18:3<416:DAFISF>2.0.ZU;2-N
Abstract
While WSI-based devices continue to be of particular interest for appl ications with severe performance, size, weight, power, cost, and relia bility requirements [1]-[3], various implementation constraints in the past, including interconnect defect occurrences, have prevented their successful realization, This paper presents an investigation into def ect and fault tolerant interconnect strategies for a representative WS I device, WASP (WSI Associative String Processor [3]).