RELATIONSHIPS BETWEEN PROCESSING TEMPERATURE AND MICROSTRUCTURE IN ISOTHERMAL MELT-PROCESSED BI-2212 THICK-FILMS

Authors
HOLESINGER TG PHILLIPS DS WILLIS JO PETERSON DE
Citation
Tg. Holesinger et al., RELATIONSHIPS BETWEEN PROCESSING TEMPERATURE AND MICROSTRUCTURE IN ISOTHERMAL MELT-PROCESSED BI-2212 THICK-FILMS, IEEE transactions on applied superconductivity, 5(2), 1995, pp. 1939-1942
Citations number
10
Categorie Soggetti
Engineering, Eletrical & Electronic","Physics, Applied
Journal title
IEEE transactions on applied superconductivity → ACNP
ISSN journal
10518223
Volume
5
Issue
2
Year of publication
1995
Part
2
Pages
1939 - 1942
Database
ISI
SICI code
1051-8223(1995)5:2<1939:RBPTAM>2.0.ZU;2-#
Abstract
The microstructure ar 1 phase assemblage of isothermal meltprocessed ( IMP) Bi2Sr2CaCu2Oy (Bi-2212) thick films have been evaluated. Results from compositional analysis and phase identification indicate that the characteristics of the partial melt greatly influence the microstruct ural and chemical development of the thick films. The highest critical current densities were obtained in films processed below 800 degrees C where the partial melt uniformly coats the substrate without excessi ve phase segregation.