ANTIREFLECTION COATING OF TIO2 STUDY AND DEPOSITION BY THE SCREEN PRINTING METHOD

We are developing the Screen Printing technique for depositing a singl e layer quarter wavelength thick antireflection coating of titanium di oxide on silicon substrate. The ink is composed by the titanium ethoxi de as the organometallic compound, terpineol as the solvent and the oc typhenoxy polyethoxy as the vehicle. It has been applied to 4 inch pol ished silicon wafers, dried then fired and characterized. The objectiv e of our work was to control the deposition parameters and the ink vis cosity to determine their effects on the layer properties. The thickne sses of the TiO2 films were measured by the stylus technique using a P rofilometer. AES, RES and X-Ray diffraction are used to analyse the la yer and to determine its structure and composition according to firing temperatures. The reflection coefficient is measured as a function of the wavelength. As a result, we obtain TiO2 coating thicknesses betwe en 600 and 800 Angstrom and a minimum reflection near 600nm.