ELECTROCHEMICAL ASPECTS OF CORROSION-RESISTANCE AND ETCHING OF METALLIZATIONS FOR MICROELECTRONICS

The electrochemical aspects of metal etching to form patterned conduct ors and of corrosion of conductors in the field are closely related. B oth need to be considered in designing metallization structures for mi croelectronic devices. The evolution of a manufacturing process for a multi-level interconnect structure is discussed from an electrochemica l perspective. A galvanic corrosion problem during manufacture and its solution for the interconnect metallization on a silicon integrated c ircuit are also discussed. Following the discussion on etching process es and corrosion during manufacture, a discussion of electrochemical a nd electrolytic failure mechanisms for electronic equipment in field e nvironments and some steps that can be taken to prevent harmful enviro nmental effects are presented. Recent research on the adhesion of vari ous protective coatings and interlevel polymeric dielectrics is presen ted in the context of failure prevention.