ELECTROCHEMICAL STUDIES ON CORROSION UNDER A WATER FILM

Citation
T. Tsuru et al., ELECTROCHEMICAL STUDIES ON CORROSION UNDER A WATER FILM, Materials science & engineering. A, Structural materials: properties, microstructure and processing, 198(1-2), 1995, pp. 161-168
Citations number
17
Categorie Soggetti
Material Science
ISSN journal
09215093
Volume
198
Issue
1-2
Year of publication
1995
Pages
161 - 168
Database
ISI
SICI code
0921-5093(1995)198:1-2<161:ESOCUA>2.0.ZU;2-6
Abstract
The corrosion mechanism and corrosion rate were studied as a function of the water film thickness using Kelvin probe (non-contacting referen ce electrode) and impedance methods. Cathodic polarization curves were measured at different film thicknesses on copper, platinum, iron and gold electrodes. The diffusion-limiting current of oxygen increased wi th decreasing thickness to around 20-30 mu m, and then decreased with decreasing thickness. The corrosion rate of copper as a function of th e water film thickness was measured by the impedance method. It was co nfirmed that the rate is constant for a thick film, increases with dec reasing thickness to give a maximum and then decreases, as reported by Tomashov. The water film thickness was measured by the solution resis tance of the water film. Using the impedance method, the corrosion rat es of steels were monitored during wet and dry cycles. The importance of monitoring the corrosion rate, during evaluation or conventional co rrosion tests, is illustrated by the results.