T. Tsuru et al., ELECTROCHEMICAL STUDIES ON CORROSION UNDER A WATER FILM, Materials science & engineering. A, Structural materials: properties, microstructure and processing, 198(1-2), 1995, pp. 161-168
The corrosion mechanism and corrosion rate were studied as a function
of the water film thickness using Kelvin probe (non-contacting referen
ce electrode) and impedance methods. Cathodic polarization curves were
measured at different film thicknesses on copper, platinum, iron and
gold electrodes. The diffusion-limiting current of oxygen increased wi
th decreasing thickness to around 20-30 mu m, and then decreased with
decreasing thickness. The corrosion rate of copper as a function of th
e water film thickness was measured by the impedance method. It was co
nfirmed that the rate is constant for a thick film, increases with dec
reasing thickness to give a maximum and then decreases, as reported by
Tomashov. The water film thickness was measured by the solution resis
tance of the water film. Using the impedance method, the corrosion rat
es of steels were monitored during wet and dry cycles. The importance
of monitoring the corrosion rate, during evaluation or conventional co
rrosion tests, is illustrated by the results.