THERMODYNAMIC SIMULATION OF YBA2CU3O6+X FILM GROWTH USING AEROSOL MOCVD

Citation
F. Weiss et al., THERMODYNAMIC SIMULATION OF YBA2CU3O6+X FILM GROWTH USING AEROSOL MOCVD, Journal de physique. IV, 5(C5), 1995, pp. 151-158
Citations number
11
Categorie Soggetti
Physics
Journal title
ISSN journal
11554339
Volume
5
Issue
C5
Year of publication
1995
Part
1
Pages
151 - 158
Database
ISI
SICI code
1155-4339(1995)5:C5<151:TSOYFG>2.0.ZU;2-N
Abstract
Future high power applications of high T-c superconducting materials ( like YBa2Cu3O6+x) demand thick films with excellent electrical propert ies. The use of thin film deposition techniques is only possible when high deposition rates can be reached. A novel aerosol MOCVD technique using a liquid source has recently been developed and is very promisin g for this purpose. The precursor materials used are the beta-diketona tes of yttrium, barium and copper, dissolved in diethylene glycol dime thyl ether (''diglyme'') in various concentrations. A preliminary ther modynamic simulation of the process is a useful tool for a deeper unde rstanding of the stability limits of the superconducting phase and the on-going reactions during deposition. The results of these simulation s have been used to optimise the process conditions for YBa2Cu3O6+x gr owth with good superconducting properties. A comparison between the si mulation and the experimental results will be given and the influence of the main process parameters (deposition temperature, oxygen partial pressure, precursor concentration, ...) will be shown.