IMPROVED PLATING OF SMALL HOLES AND OTHER BENEFITS FOUND USING PULSE PLATING OF ACID COPPER IN PCB MANUFACTURE

Trials have been carried out over the last year in the manufacture of Printed Circuit Boards (PCB) rising Schlotter PC81 Acid Copper in Puls e mode. The trials monitored the performance of the chemistry under pr olonged pulse conditions, the reliability of the Pulse Rectification u nits, as well as evaluating the benefits of the process to the PCB man ufacturer: It may be concluded from the trials that there are consider able benefits to be derived from the procedure. These benefits are: 1) A reduction in average plating time by 30% to 50%. 2) 1:1 or better h ole to surface copper distribution. 3) A reduction in average track he ight of 50%.