THE EFFECT OF TRIS(HYDROXYMETHYL)AMINOMETHANE ON THE STABILITY OF CHEMICAL COPPER-PLATING SOLUTIONS AND PROCESS RATE

Authors
PETROVA TP RAKHMATULINA IF SHAPNIK MS
Citation
Tp. Petrova et al., THE EFFECT OF TRIS(HYDROXYMETHYL)AMINOMETHANE ON THE STABILITY OF CHEMICAL COPPER-PLATING SOLUTIONS AND PROCESS RATE, Protection of metals, 31(4), 1995, pp. 374-376
Citations number
5
Categorie Soggetti
Metallurgy & Metallurigical Engineering
Journal title
Protection of metals → ACNP
ISSN journal
00331732
Volume
31
Issue
4
Year of publication
1995
Pages
374 - 376
Database
ISI
SICI code
0033-1732(1995)31:4<374:TEOTOT>2.0.ZU;2-F
Abstract
It has been suggested for the first time to use tris(hydroxymethyl)ami nomethane (TRIS) for chemical copper plating. TRIS increases the coppe r deposition rate and stability of solution. An empirical equation has been derived that enables one to determine the process rate as a func tion of the temperature and concentration of components.