Ultrashallow junctions (similar to 60 nm) are obtained using low energ
y BF2 (5 keV) implants in crystalline Si. The variation of junction de
pth as a function of the dose rate is studied for doses of 1 x 10(14)
and 1 X 10(15) cm(-2). Boron diffusion is retarded in the tail region
for the higher dose rates and consequently the junction depth decrease
s as compared to the lower dose rates. The residual defect density aft
er a 950 degrees C, 10 a anneal for a dose of 1 X 10(15) cm(-2) is red
uced for the higher dose rate as compared to the lower dose rate. (C)
1995 American Institute of Physics.