L. Koller et al., REDUCTION OF OUTGASSING FROM SILVER ALLOY CONTACTS SURFACE BY AU ELECTROPLATED LAYER FOR USE IN HERMETIC RELAYS, Vacuum, 46(8-10), 1995, pp. 827-829
The gold electroplated surface layer of silver alloy (Ag with 0.1 wt%
Mg) appears to play an important role for hermetic relays, simultaneou
sly decreasing contact resistance with increasing lifetime. The thickn
ess of the gold layer is approximately 0.5 mu m. The annealing at 135
degrees C and 200 degrees C provides a surface of extremely low outgas
sing at contact operation. The surface of the gold layer is investigat
ed by Auger Electron Spectroscopy (AES) and the outgassed products by
mass spectroscopy in a high vacuum experimental system. The gold elect
roplating and subsequent annealing improve the desorption of the surfa
ce at low outgassing rate.