AES and XPS have been used for investigation of the elemental composit
ion and the chemical bonding in rf sputtered tantalum oxide (4-75 nm)
on Si, depending on gas mixture (O-2 content in the gas 0.2-50%) at tw
o substrate temperatures. The effect of post deposition anneal in dry
O-2 has also been considered. The results indicate that 10% O-2 conten
t and substrate temperature 300 K favour formation of stoichiometric T
a2O5 and an abrupt interface transition region between Si and Ta2O5. T
he annealing leads to homogenization of the layers and improves additi
onally their stoichiometry.