3-DIMENSIONAL MMIC AND ITS APPLICATION - AN ULTRA-WIDE-BAND MINIATUREBALUN

A new three-dimensional MMIC structure and an ultra-wideband miniature MMIC balun are proposed. The MMIC is a combined structure of multilay er MMICs and U-shaped micro-wires. This technology effectively reduces chip size and enhances MMIC performance. The proposed balun is constr ucted with three narrow conductors located side by side. The U-shaped micro-wire technology is employed to reduce the insertion loss and chi p size. 1.5+/-1 dB insertion loss over 10 to 30 GHz, and 2 dB and 5 de grees of amplitude and phase balances over 5 to 35 GHz have been obtai ned. The intrinsic area of the balun is only 450 x 800 mu m, about 1/5 to 1/3 the area of recently reported miniaturized MMIC baluns.