J. Schubert et al., MECHANISM OF TIN FILM DEPOSITION BY REACTIVE EVAPORATION MEASURED BY A QUARTZ-CRYSTAL MICROBALANCE, Surface & coatings technology, 74-5(1-3), 1995, pp. 528-533
Three quantities must be known for investigation of the reaction mecha
nism of reactive evaporated TiN coatings: the impingement of nitrogen
molecules and of titanium atoms on the surface of the TiN film and the
rate of TiN formation. The nitrogen impingement can be easily determi
ned by measuring the nitrogen partial pressure in the reactor. The tot
al rate of reacted TIN can be measured very accurately by a quartz cry
stal microbalance (QCM). Determination of the third quantity, the tita
nium impingement, faces some difficulties. The titanium flux to the su
rface of the film cannot simply be extrapolated by measuring the evapo
ration rate of the source in vacuum because nitrogen gas changes the s
ituation in two ways, The titanium atoms are scattered on their way fr
om the evaporation source to the TiN film surface by collisions with n
itrogen gas molecules, and the evaporation source itself is poisoned b
y nitrogen reactions and changes its evaporation characteristics. Thre
e possibilities for measurement of the titanium flux were tested in th
e present work. (1) Experiments with low nitrogen partial pressure and
low titanium evaporation rates were performed in order to avoid scatt
ering. The evaporation rate was measured by the QCM under vacuum condi
tions. (2) The titanium flux was determined by an optical spectrometer
. (3) The titanium flux was determined by a quadrupole mass analyser.
Advantages and disadvantages of the three methods are discussed and re
sults of the reaction rates are presented. The measurements show that
below an impingement ratio [N]/[Ti]=1 no detectable nitrogen is incorp
orated in the film. At higher impingement ratios the composition of th
e him is changed and at an impingement ratio [N]/[Ti]=20 a stoichiomet
ric TiN film is formed. The experimental results are compared with mod
el calculations.