Epilayer strain relaxation in the InGaAs/GaAs system occurs via two me
chanisms, plastic deformation and/or surface roughening. Under conditi
ons of two-dimensional growth, we find that compositionally graded InG
aAs/GaAs (001) multi-layer buffer structures will plastically deform w
ith <110> misfit dislocations approaching 100% strain relaxation. At h
igher growth temperatures, large-amplitude toughening is observed pref
erentially along the [110] direction, and the strain relaxation become
s asymmetric in the <110> directions. In single epilayers, the symmetr
y of the strain relaxation is dependent on the magnitude of the substr
ate offcut angle. In all cases, the epilayers develop a tilt about an
in-plane axis in proportion to and opposite in direction to the substr
ate offcut. With roughening, there is also a change in the orientation
of the tilt axis such that only the dislocations with [1(1) over bar0
$] line directions develop a preferred tilt component. These results i
llustrate the importance of surface steps and morphologies to strain r
elaxation and perhaps offer clues to the identification of the disloca
tion formation mechanisms at these interfaces.