INTEGRATION OF STEP-EDGE GRAIN-BOUNDARY JOSEPHSON-JUNCTIONS WITH YBCOMULTILAYERS FOR ELECTRONICS APPLICATIONS

Authors
DALY KP MURDUCK JM PETTIETTEHALL CL SERGANT M
Citation
Kp. Daly et al., INTEGRATION OF STEP-EDGE GRAIN-BOUNDARY JOSEPHSON-JUNCTIONS WITH YBCOMULTILAYERS FOR ELECTRONICS APPLICATIONS, IEEE transactions on applied superconductivity, 5(2), 1995, pp. 3131-3134
Citations number
5
Categorie Soggetti
Engineering, Eletrical & Electronic","Physics, Applied
Journal title
IEEE transactions on applied superconductivity → ACNP
ISSN journal
10518223
Volume
5
Issue
2
Year of publication
1995
Part
3
Pages
3131 - 3134
Database
ISI
SICI code
1051-8223(1995)5:2<3131:IOSGJW>2.0.ZU;2-D
Abstract
We discuss our multilayer YBCO process which uses step-edge junctions. Key issues are dielectric defect density, wiring layer critical curre nt over edges of underlying features and junction critical current uni formity. We have demonstrated an average defect density of about 450/c m(2) over many wafers. Wiring critical current exceeds 1 mA/mu m of li ne width. We have demonstrated SQUIDs at 77 K using this process.