MULTICHIP PACKAGING FOR HIGH-SPEED SUPERCONDUCTING CIRCUITS

Authors
SANDELL RD AKERLING G SMITH AD
Citation
Rd. Sandell et al., MULTICHIP PACKAGING FOR HIGH-SPEED SUPERCONDUCTING CIRCUITS, IEEE transactions on applied superconductivity, 5(2), 1995, pp. 3160-3163
Citations number
8
Categorie Soggetti
Engineering, Eletrical & Electronic","Physics, Applied
Journal title
IEEE transactions on applied superconductivity → ACNP
ISSN journal
10518223
Volume
5
Issue
2
Year of publication
1995
Part
3
Pages
3160 - 3163
Database
ISI
SICI code
1051-8223(1995)5:2<3160:MPFHSC>2.0.ZU;2-M
Abstract
We report the development of a multi-chip module (MCM) technology usin g Nh metallization and benzocyclobutene (BCB) polymer dielectric. The Nb/BCB structure displays very low loss, has low processing temperatur e, and forms a wide range of microstrip transmission line impedances. We are developing flip chip, solder attachment for die mounting. We al so report the electrical characterization of Nb/BCB/Nb for both micros trip resonators, delay lines, and bandpass filters.