Cg. Hubner et al., TEM STUDIES OF THE MICROSTRUCTURE OF PRESSURELESS SINTERED COPPER, Physica status solidi. a, Applied research, 150(2), 1995, pp. 653-660
The microstructure of electrolytic copper powder was investigated duri
ng the sintering process by means of transmission electron microscopy
and scanning electron microscopy. It is shown that the particle size,
which is important for shrinkage, is much smaller than the size of the
agglomerates obtained by sieving. The particles are polycrystalline w
ith crystallite sizes of about 1 mu m at the beginning of the sinterin
g process. Both ex-situ and in-situ sintering were performed. During t
he sintering process the crystallite size increases. Recrystallization
twinning is observed at temperatures above 400 degrees C. The samples
show local dislocation densities of about 10(8) to 10(9) cm(-2). The
shrinkage velocities of Coble, Nabarro-Herring, and dislocation creep
are calculated and compared to the value experimentally obtained. The
shrinkage velocities of all three transport mechanisms discussed here
are in the same order of magnitude.