HIGH-RESOLUTION TEMPERATURE-MEASUREMENT OF VOID DYNAMICS INDUCED BY ELECTROMIGRATION IN ALUMINUM METALLIZATION

The local temperature of aluminum metallization is measured directly d uring electromigration. High resolution thermography is used to detect void dynamics induced by a de current. In the vicinity of the growing area, infrared radiation pulses less than 0.5 s wide are observed con comitant with resistance pulses. Their amplitudes are found to corresp ond to a temperature increase of more than 200 degrees C, which locall y exceeds the melting point of aluminum metallization. These pulses oc cur as a consequence of void movement. Healing of voids is discussed a long with the results. (C) 1995 American Institute of Physics.