At present, the widespread use of optoelectronic components is restric
ted by their high cost. Up to 90% of the cost of a semiconductor laser
is in the packaging, with the fibre-chip alignment the major part. In
this paper, an approach to low cost packaging is described, which use
s an integrated mode size transformer to match the laser output to the
fibre mode. This improves the alignment tolerance of the laser-fibre
coupling by more than a factor of three, allowing simple passive align
ment approaches to be used. It requires only minor modification to the
processing of a standard buried heterostructure laser, and allows the
coupling efficiency to be optimised without compromising the performa
nce of the laser. The design of a silicon submount for passive laser-f
ibre alignment is described and coupling losses as low as 1.2 dB to st
andard cleaved single mode fibre are reported. The technology that has
been developed is generic and its successful application to other opt
oelectronic devices such as fibre grating lasers, semiconductor optica
l amplifiers and laser arrays is described.