LOW-COST OPTICAL MODULE PACKAGING TECHNIQUES FOR OPTICAL ACCESS NETWORK SYSTEMS

This paper describes packaging techniques based on a novel passive ali gnment technique as key techniques for module assembly. A laser diode (LD) is passively positioned by detecting a pair of alignment marks lo cated on the LD and Si substrate. A single-mode fiber is self aligned on a Si V groove. A simple receptacle structure for the module output port is also newly designed. This structure is more suitable For the a utomatic assembly line as well as the module mounting process on circu it board. In this paper, an advanced module applications such as a hyb rid integrated wave guide module and a surface mountable (SMT) LD modu le is introduced.