A TECHNOLOGY ORIENTED MODEL FOR TRANSIENT DIFFUSION AND ACTIVATION OFBORON IN SILICON

Citation
A. Hofler et al., A TECHNOLOGY ORIENTED MODEL FOR TRANSIENT DIFFUSION AND ACTIVATION OFBORON IN SILICON, Journal of applied physics, 78(6), 1995, pp. 3671-3679
Citations number
29
Categorie Soggetti
Physics, Applied
Journal title
ISSN journal
00218979
Volume
78
Issue
6
Year of publication
1995
Pages
3671 - 3679
Database
ISI
SICI code
0021-8979(1995)78:6<3671:ATOMFT>2.0.ZU;2-C
Abstract
We propose a model for point-defect-assisted transient diffusion and a ctivation of high-dose boron implants in silicon. To model transient d iffusion, a nonlinear equilibrium clustering model for point defects i s used. The activation of boron is modeled as a Fenni-level-dependent transformation of inactive dopant clusters to substitutional atoms. Co mparison with experimental data shows that this approach can provide a description of both rapid thermal annealing and long-time furnace ann ealing steps, with an excellent predictive capability for both chemica l and electrically active profiles. (C) 1995 American Institute of Phy sics.