A. Hofler et al., A TECHNOLOGY ORIENTED MODEL FOR TRANSIENT DIFFUSION AND ACTIVATION OFBORON IN SILICON, Journal of applied physics, 78(6), 1995, pp. 3671-3679
We propose a model for point-defect-assisted transient diffusion and a
ctivation of high-dose boron implants in silicon. To model transient d
iffusion, a nonlinear equilibrium clustering model for point defects i
s used. The activation of boron is modeled as a Fenni-level-dependent
transformation of inactive dopant clusters to substitutional atoms. Co
mparison with experimental data shows that this approach can provide a
description of both rapid thermal annealing and long-time furnace ann
ealing steps, with an excellent predictive capability for both chemica
l and electrically active profiles. (C) 1995 American Institute of Phy
sics.